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Copper Skin on the Strength and the Electrical and Thermal Conductivities of Reduced Graphene Oxide-Printed Scaffolds
| dc.contributor.author | Moyano Campos, Juan José | |
| dc.contributor.author | Mosa Ruiz, Jadra | |
| dc.contributor.author | Aparicio, Mario | |
| dc.contributor.author | Pérez Coll, Domingo | |
| dc.contributor.author | Belmonte, Manuel | |
| dc.contributor.author | Miranzo López, Pilar | |
| dc.contributor.author | Osendi, María Isabel | |
| dc.date.accessioned | 2021-09-30T08:26:38Z | |
| dc.date.available | 2021-09-30T08:26:38Z | |
| dc.date.issued | 2020 | |
| dc.identifier.citation | J.J. Moyano, J. Mosa, M. Aparicio, D. Pérez-Coll, M. Belmonte, P. Miranzo, M.I. Osendi Strong and light cellular silicon carbonitride – Reduced graphene oxide material with enhanced electrical conductivity and capacitive response Additive Manufacturing, Volume 30, December 2019, Pages 100849 https://doi.org/10.1016/j.addma.2020.101054 http://hdl.handle.net/10261/214246 | es |
| dc.identifier.issn | 22147810 | |
| dc.identifier.uri | http://hdl.handle.net/20.500.12251/1884 | |
| dc.description.abstract | The authors regret the mistake made when transcribing the gravimetric capacitance data reported in the previous article, the corrected values are as follows: The gravimetric capacitance was calculated using the discharge curves at different current densities, reaching 50.3, 39.1 and 41.3 F g−1 for 0.06, 0.60 and 2.40 A g−1, respectively. The authors wish to comment that these values do not alter the conclussions of the article, but rather accentuate the capacitive performance of the structures. The authors would like to apologise for any inconvenience caused. © 2020 Elsevier B.V. | es |
| dc.language.iso | eng | es |
| dc.publisher | Elsevier B.V. | es |
| dc.rights | Attribution-NonCommercial-NoDerivatives 4.0 Internacional | * |
| dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/4.0/ | * |
| dc.title | Copper Skin on the Strength and the Electrical and Thermal Conductivities of Reduced Graphene Oxide-Printed Scaffolds | es |
| dc.type | article | es |
| dc.identifier.doi | 10.1016/j.addma.2020.101054 | |
| dc.identifier.url | https://doi.org/10.1016/j.addma.2020.101054 | es |
| dc.journal.title | Additive Manufacturing | es |
| dc.rights.accessRights | openAccess | es |
| dc.subject.keyword | Material de construcción | es |
| dc.subject.keyword | Galvanización | es |
| dc.subject.keyword | Conductividad térmica | es |
| dc.subject.keyword | Disipador de energía | es |
| dc.subject.keyword | Cobre | es |
| dc.subject.keyword | Electrónica | es |
| dc.subject.keyword | Estructuras de grafeno | es |
| dc.subject.unesco | 3313.04 Material de Construcción | es |
| dc.subject.unesco | 2303.12 Grafito | es |
| dc.subject.unesco | 3315.02 Cobre | es |
| dc.subject.unesco | 2307 Química Física | es |
| dc.subject.unesco | 3312.08 Propiedades de Los Materiales | es |
| dc.subject.unesco | 3312.12 Ensayo de Materiales | es |
| dc.subject.unesco | 3307.93 Microelectrónica. Diseño | es |
| dc.volume.number | 32 | es |
| dc.item.number | 101054 | es |
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