Mostrar el registro sencillo del ítem

dc.contributor.authorSepulveda, A.
dc.contributor.authorMuñoz, R.
dc.contributor.authorLovey, F. C.
dc.contributor.authorAuguet Sangrá, Carlota
dc.contributor.authorIsalgue, Antonio
dc.contributor.authorTorra, Vicenc
dc.date.accessioned2026-07-01T08:01:11Z
dc.date.available2026-07-01T08:01:11Z
dc.date.issued2007
dc.identifier.citationSepulveda, A., Muñoz, R., Lovey, F. C., Auguet Sangrá, C., Isalgue, A., y Torra, V. (2007). Metastable effects on martensitic transformation in SMA : PPPart II. the grain growth effects in Cu-Al-Be alloy. Journal of Thermal Analysis and Calorimetry, 89(1), 101-107. https://doi.org/10.1007/s10973-005-7480-3es
dc.identifier.issn1388-6150
dc.identifier.urihttp://hdl.handle.net/20.500.12251/5612
dc.description.abstractThe efficiency of shape memory alloy (SMA) as damper and/or standard actuator is truly enhanced when the material can be cycled without any relevant accumulation of the permanent deformation (i.e. under 0.5% for several hundreds of cycles). The particular properties of the CuAlBe alloy permit relevant grain growth with reasonable reduction of mechanical properties (from 300-350 to 250-300 MPa at fracture). Samples prepared with an appropriate heat thermal treatment (HTT) and relevant mean diameter of grain avoids accumulative deformation for series of cycles (near 500) up to 3.5% of deformation. The analysis of different wires of CuAlBe alloy shows, in the first part of HTT, a proportionality between the grain surface and the time at 1123 K. In the last part of the HTT the grain growth shows an increased complexity related with interactions between the grain boundaries and the external surface of the samples. © 2007 Springer Science+Business Media LLC.es
dc.language.isoenges
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 Internacional*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.titleMetastable effects on martensitic transformation in SMA : PPPart II. the grain growth effects in Cu-Al-Be alloyes
dc.typearticle
dc.identifier.doi10.1007/s10973-005-7480-3
dc.identifier.urlhttp://www.scopus.com/inward/record.url?eid=2-s2.0-36049028709&partnerID=40&md5=32e9b3fff3875152d0d7c3b0de8be93f
dc.issue.number1es
dc.journal.titleJournal of Thermal Analysis and Calorimetryes
dc.page.initial101es
dc.page.final107es
dc.rights.accessRightsopenAccesses
dc.subject.keywordAleación con memoria de forma (SMA)es
dc.subject.unesco3305.90 Transmisión de Calor en la Edificaciónes
dc.subject.unesco3312 Tecnología de Materialeses
dc.subject.unesco1209.03 Análisis de Datoses
dc.subject.unesco1209.09 Análisis Multivariantees
dc.subject.unesco3328.16 Transferencia de Calores
dc.subject.unesco3312.08 Propiedades de Los Materialeses
dc.subject.unesco3312.09 Resistencia de Materialeses
dc.subject.unesco5311 Organización y Dirección de Empresases
dc.subject.unesco5312 Economía Sectoriales
dc.volume.number89


Ficheros en el ítem

FicherosTamañoFormatoVer

No hay ficheros asociados a este ítem.

Este ítem aparece en la(s) siguiente(s) colección(ones)

Mostrar el registro sencillo del ítem

Attribution-NonCommercial-NoDerivatives 4.0 Internacional
Excepto si se señala otra cosa, la licencia del ítem se describe como Attribution-NonCommercial-NoDerivatives 4.0 Internacional